PCB Assembly Equipment

Our facility comprises equipment for all the stages of PCB design and assembly. These include

1. Design software

2. Prototyping

3. Soldering

4. Prepping and kitting

5. Pick and place systems

6. Assembly work stations

7. Surface Mount Assembly (SMT)

8. Through Hole Assembly (PTH)

At Creative Hi-Tech Ltd. (CHTL), we understand that successful design and assembly of standard and custom PCBs is achieved only by using latest software and equipment.

Whether we get small prototyping, or large production orders from clients, we strive to ensure that our PCBs are of high quality, and meet all client and application requirements.

As a leader in PCB assembly in USA, we continually upgrade our facility with the latest PCB design and assembly equipment.

A Look at our PCB Assembly Equipment and their Capabilities

As a provider of PCB assembly services Illinois, our facility houses two production lines, prepping systems, as well as workstations, assembly lines, and assorted systems for SMT and PTH processes respectively. The following lists provide complete information regarding all the PCB assembly equipment used at our facility.

Prepping and Kitting Equipment

Material Storage with RoHS Compliance Area
- Ideal Wire Processor
- GPD CF-8 Component Former
- PEI OLAMEF TP6 Lead Formation System
- Hepco 8000-1 Axial Lead Formation System
- Hepco-APS 1500-1 Radial Lead Formation System

Surface Mount Technologies

SMT Line 1:

Speedline MPM / Ultraflex 3000 Printer
- Screen Printer with Camera System, Aperture to Pad learning, “Gridlock” Board Support System, etc.

Juki RS-1 Pick & Place Machine
- Laser Alignment
- Chip Shooter Placement at 42,000 CPH
- From 0201 to 74mm sq. Component Placement Capability

Juki RS-1 Pick & Place Machine
- Laser Alignment & Vision System
- Fine Pitch, BGA, & MicroBGA Placement at 42,000 CPH
- From 0201 to 74mm sq. Component Placement Capability

Juki Matric Tray Changer
- Capable up to 44 Different Types of QFP, QFN, BGA, CSP, etc.
- 30 tray capacity

Vitronics Soltec XPM2 with Brush Roller Output
- Lead-free Compatibility
- 10 Zone Air Convection Reflow

SMT Line 2:

Speedline MPM Accuflex Printer
- Screen Printer with 2D Camera System, Auto Pin Placement, Auto Wiper, etc.

Juki JX-100 Pick & Place Machines
- Laser Alignment System
- Chip Shooter, Placement at 16,000 CPH
- From 0201 to 74mm sq. Component Placement Capability

Juki KE2060E Pick & Place Machinee
- Laser Alignment & Vision System
- 7 Mil Pitch, BGA, & MicroBGA Placement
- From 0201 to 74mm sq. Component Placement Capability
- Placement at 12,500 CPH (Laser Centering/Effective Tact)
- 1 Multi-nozzle Laser Head along with 1 High Resolution Head

Juki Matric Tray Changer
- Capable up to 44 Different Types of QFP, QFN, BGA, CSP, etc.
- 20 tray capacity

Vitronics Soltec XPM2 with Brush Roller Output
- Lead-free Compatibility
- 10 Zone Air Convection Reflow Including a 3 Zone Cooling System with Nitrogen Option

Inspection Equipment

Mirtec MV-6 Omni 3D AOI
- 15 mega pixel CoaXPress Camera Technology
- 8 Phase color lighting system
- 10 Mega pixel side viewer camera
Genrad ICT
Glenbrook Jewel Box 70LC X Ray Machine

Plated Through Hole Technologies

IAC TH Assembly Workstation

Techmation Assembly Line

Electrovert Vectra Elite Wave Solder System
- Lead-free Capabilities & “Quick Change” Solder Pot
- 3 Convection Preheaters, 1 Infrared Preheater, & Dual Wave Capabilities
- ServoJet Programmable Fluxer Module with Self-contained External Fluxer Cabinet
- Real-time 3D Graphic Animation of System & Process
- User-friendly Operator Interface Console with Storage for 5000+ Unique Recipes

Conveyer Technologies Unloader

Q2G-2000 Lead Trimming System

Nordson Novo 102 Selective Solder
- Max Board Size 406 x 406 mm (16.0 x 16.0 in.)
- 15 minute setup time
- High-speed Z-axis motion
- Atomizing spray flux applicator
- Heated nitrogen inerting system
- Standalone platform ideal for prototype, cell manufacturing or batch production
- Interchangeable solder pots and pumps compatible with tin-lead, lead-free and HMP solder alloys
- Single selective solder nozzle, dual selective nozzles with independent control or 75 mm wide wave soldering nozzle